Overview
* This role is responsible for all Product Engineering activities in our 300mm Durham fab.
* The main work includes both Production wafer-level (CP/WS) and die-level functional test methodology development, involving design hardware and software solutions, conducting data analysis, and collaborating with cross-functional teams to ensure product quality and optimal performance.
* The candidate will play a leading role in driving continuous improvement in yield, test coverage, and product quality while supporting new product introductions (NPI) and customer satisfaction.
Key tasks
* Participate in design and develop chip test methodology, including hardware Probecard schematics, layout, software test flow, and test programs.
* Work with Yield Engineers and Test Engineers to conduct routine CP calibration, engineering, production testing data analysis to identify and resolve hardware or software issues, continuously improving test coverage and stability.
* Collaborate with cross-functional teams including Design and Test Teams to define ATE test functional limits and specifications. Validate new ATE hardware and test programs through GRR analysis from NPI to ramp-up stage.
* Participate in chip functional engineering test, characterization, and qualification plans for NPI products. Support qualification test hardware builds and test program development.
* Support DFM, DFR, and DFT development strategy and device modelling plan, continue to improve testability to optimize flow and reduce test time/cost.
* Evaluate production RMA customer return parts at ATE Chip Probe, Final Test, and/or system level test and drive necessary failure analysis, 8D, and continuous improvement to meet quality and company DPPM targets.
Qualifications and training
* Bachelor’s degree in Physics, Electronics, Microelectronics, Semiconductor, or related field.
Skills and experience
* Product Engineering experience in high-volume wafer Fab/Foundry, Fabless, ATE Test House, or Chip Assembly plants.
* Solid knowledge of Chip Test HW and TP Software design methodologies.
* Strong data analytical skills with experience using semiconductor analysis software.
* Excellent interpersonal and communication skills, good ability to work effectively in a cross-functional team environment.
* Familiarity with chip qualification standards and procedures.
* Yield or test experience is desired.
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