Job Overview
As a Hardware Design Engineer at Salience Labs, you will play a crucial role in creating and testing the electronics that power our innovative hybrid photonic-electronic systems. As an early member of our team, you will directly contribute to our mission of bringing cutting-edge photonic products to high-performance compute systems, particularly those used for AI. This role offers a dynamic mix of system design, PCB design, system bring-up, and qualification, with a portion of hands-on lab work at our Oxford office.
What you'll be doing
1. Detailed hardware design, including specification, simulation, schematic capture (using Altium), and component selection. PCB layout experience is a strong advantage.
2. Bringing up and testing new hardware in the lab, focusing on the electronic components and their interaction with photonic elements.
3. Diagnosing and resolving issues during hardware bring-up and testing.
4. Thoroughly characterizing new electronic systems and their integration with photonic components.
5. Characterizing the mechanical and thermal properties of the systems and their impact on photonic performance.
6. Qualifying electronic systems for production, collaborating with external test houses as needed.
What we're looking for
1. 3+ years of experience in high-speed digital or analogue design, encompassing high-speed discrete analogue-to-digital conversion, high-performance FPGAs, and high-speed digital interfaces (including Ethernet and DDR).
2. 3+ years of experience in bringing up and testing new electronic systems.
3. Proficiency in diagnostic engineering, including strong rework skills.
4. Comfort working both independently and within small, multidisciplinary teams.
5. Strong technical, organizational, and time management skills to translate requirements into successful hardware implementations.
6. Drive, motivation, and flexibility to thrive in a fast-paced start-up environment.
Even better if you
1. Have experience with PCB layout.
2. Have experience working with external vendors for layout, manufacturing, assembly, and qualification.
3. Have experience characterizing mechanical and thermal properties of electronic systems.
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