Our cutting-edge client is currently searching for a Packaging Engineer to join the photonics operations team. The role will involve working with engineering and product development teams to specify required packaging solutions for volume manufacture.
Working with vendors to select and qualify assembly processes will be required, as well as coordinating day-to-day management of external vendors.
Required skills for the Packaging Engineer include:
1. Experience with assembly packaging techniques including dicing, die attach, flip chip, wire bonding, etc.
2. Knowledge of semiconductor device manufacturing steps and high-volume testing and packaging and product development.
3. Photonics packaging experience desirable.
4. Strong communication skills.
5. Master’s degree in a relevant technical field.
Please contact Rachel Anderson for further details.
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