Purpose of the role: Working with a team of experienced RF, electronics and mechanical engineers you will contribute to the design of radio frequency products, with responsibility for schematic capture, PCB layout and library management, translating circuit designs into manufacturable PCBs ensuring that electrical performance, quality, cost and manufacturability requirements are met. Summary of Responsibilities : Together with inputs provided by our team of RF engineers, you will design and layout electronic circuits incorporating mixed technologies for telecommunications and defence products. Collaborate with electrical engineers to ensure optimal component placement and routing, meeting performance, power, and signal integrity requirements. Optimize PCB layout for factors such as signal integrity, power delivery, thermal management, and manufacturability. Ensure designs comply with design rules, electrical constraints, and manufacturability guidelines. Implement best practices for component placement, routing, and layer stack-up to meet stringent design and performance criteria. Perform DRC and ERC to identify design errors early in the process and work to resolve issues. Manage and maintain a library of components, footprints, and symbols. Select appropriate components based on design specifications and ensure proper documentation. Generate and maintain detailed design documentation, including assembly drawings, bill of materials (BOM), and stack-up definitions. Assist with testing and debugging of prototypes and support manufacturing teams during PCB fabrication and prototype assembly. Work with PCB manufacturers to ensure designs are optimized for fabrication and assembly. Communicate and negotiate design specs and changes with PCB vendors and CEM subcontractors Handle component obsolescence issues and propose suitable alternatives. To meet departmental objectives as allocated by Team Leader. The successful candidate will satisfy the following requirements: Relevant HND (or equivalent). Experience in circuit schematic capture, multi-layer, mixed-technology layout and manufacturing pack generation using Altium Designer. Strong understanding of PCB fabrication and assembly processes. Experience defining stack-ups based on transmission line impedance requirements Proficiency in component selection, schematic capture, and layout techniques. Ability to effectively use version control (SVN, Git) within Altium Designer. An awareness of high-volume surface mount process / technologies and design for high volume manufacture. Ability to conduct minor SMT reworks down to 0402 component size desirable. Experience of RF / microwave electronic circuit design and implementation desirable.