Job Overview:
We seek an Electronics Engineer with experience of PCB Chip packaging co-design to join Arm’s Hardware Platforms/PCB team to be part of the design of new compute platforms. The team is based in Cambridge, UK, working at the forefront of embedded design focusing on prototyping Arm's latest IP products.
We develop physical hardware development platforms, based around Arm's custom system-on-chip (SoC) and FPGAs. The platforms are used for software development and validation activities for both our external partners/customers and our internal development teams.
Responsibilities:
The specification, development and commissioning of new hardware platforms. Focus on driving the PCB development alongside the chip packaging team, including PCB breakout strategies and SI and PI analysis. Working closely with the program team, competency in planning and scheduling tasks, to meet project timescales, is also essential.
Required Skills and Experience
* High speed design experience with extensive knowledge in PCB stack-ups and topologies
* Experience in working alongside a chip packaging team. Able to influence and advise on the pinout of SoCs based on PCB analysis efforts including cost optimization, feasibility and trade-off analysis
* Experienced in escape routing analysis of high density SoCs and able to provide estimates of the IO count that can be routed with a particular stack-up and design rule set
* Detailed knowledge of Signal Integrity analysis of high and Power Integrity techniques from both board design and chip packaging perspectives
* Detailed knowledge of embedded system board design, designing with complex LSI devices such as FPGAs, demonstrating an understanding of various high speed IO interface standards such as PCIe and DDR
Desirable Skills and Qualities
The following skills are not essential for this role, but experience in any of the following areas would enhance the application:
* Experience in using Cadence CIS, Mentor PADs Layout, Allegro PCB design suite and Hyperlynx tools
* Experience of automating: decoupling capacitor optimization, DCR, SI, IC placement optimization etc
* Enjoys collaborating and working in a team environment.
In Return:
You will gain a deeper understanding of system architecture and performance. Work alongside many other engineering teams including software, SoC implementation and verification, collaborating and enabling engineers and designers. Extending your board level design expertise, producing high quality PCB designs incorporating Arm IP, you will enjoy new technical challenges faced when using advancing technologies!
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