Technical Director – Solutions Engineering
Help Lead the Delivery of Arm’s Next-Generation Solutions
Job Description
Arm’s Solutions Engineering team is seeking a Technical Director to lead the successful delivery of advanced SoC-based solutions. In this high-impact role, you’ll collaborate with Product Management, Engineering teams, and key partners to drive Core Subsystems (CSS), droplet, and SoC development from concept through to production.
With deep expertise in SoC architecture, integration, and program leadership, you’ll guide multi-functional teams to deliver high-performance silicon on time and within budget—while driving innovation and efficiency throughout the development lifecycle.
Responsibilities
1. Own program execution for Arm’s advanced solutions—from initial concept to final production.
2. Develop and lead program schedules, identifying key dependencies, critical paths, and resource needs.
3. Lead product development for CSS and droplet programs, managing engineering investigations, design execution, and roadmap alignment.
4. Drive integration of IP blocks into CSS and support physical implementation and validation.
5. Engage directly with customers, supporting CSS integration, delivery, and post-silicon activities.
6. For full SoCs, oversee:
1. BootROM and board enablement for silicon validation
2. Reference platform delivery
3. Package and platform design
4. Product power, performance, and design quality metrics
7. Ensure timely issue resolution, manage program change requests, track KPIs, and maintain risk logs.
8. Collaborate with finance teams to monitor the total cost of ownership and track budgets across development stages.
9. Lead SOW processes for design resource services and consolidate resource needs across domains.
10. Act as the primary point of contact for the program internally and externally, communicating status, risks, and mitigation plans with executive and cross-functional stakeholders.
Required Skills & Experience
1. Bachelor’s degree or higher in Computer Science, Electrical Engineering, or a related field.
2. Demonstrated ability managing complex SoC and subsystem design programs from concept to production.
3. Deep expertise in IP integration, SoC architecture, and physical implementation workflows.
4. Strong leadership and decision-making capabilities across diverse, cross-functional engineering teams.
5. Ability to communicate a clear technical vision and influence outcomes at all levels—internally and externally.
6. Excellent verbal and written communication skills, with a track record of executive-level engagement.
'Nice to Have' Skills & Experience
1. Proven experience as a chip lead on SoC programs.
2. Background in delivering SoCs across multiple market segments (Mobile, Compute, Automotive, PC).
3. Experience with BootROM, package/board development, post-silicon qualification, and system-level integration.
4. Demonstrated success as an Engineering Program Manager (EPM) in cross-discipline environments.
In Return
We’re proud to foster a collaborative, inclusive environment guided by behaviours that help us defy ordinary and achieve excellence:
1. Partner and customer focus
2. Teamwork and communication
3. Creativity and innovation
4. Team and personal development
5. Impact and influence
6. Deliver on your promises
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