We wish to appoint a motivated technician, with good mechanical experience, to join the world leading team at the TWT Fab Sub-THz Engineering Centre at the School of Engineering for fabrication of high precision metal micro-structures. You will work with us to the fabrication and assembly activities (e.g. CNC milling, lathe, polishing, welding) to produce state of the art high precision sub-THz components. You will be offered further training and support when needed in precision cutting, TIG welding, diffusion bonding and brazing by our specialists to develop new high qualifying skills. You will work in an exciting international environment with substantial development opportunities and collaborate with top institutions and companies worldwide. The research and the TWT Fab is led by Professor Claudio Paoloni. Further detail on the TWT Fab at http://wp.lancs.ac.uk/sub-thz-electronics/. The School of Engineering is recognised for international excellence and world-leading research. The School is ranked highly in national league tables. The School has strong links with industry nationwide and works with a portfolio of hundreds of SMEs in the north-west of England alone, supported by the in-house Lancaster Product Development Unit (LPDU). The School of Engineering provides an environment that aims to meet the individual needs of each member of staff. All new staff are provided with mentoring and support. We are committed to family-friendly and flexible working policies and seek to promote a healthy work-life balance. The University is a charter member of Athena SWAN and has held a Bronze award since 2008, in recognition of good employment practice to address gender equality in higher education and research. The School achieved its own Athena SWAN Bronze award in 2018, renewed in 2023. It is a full time appointment (12 months) with possibility to be part time and of eventual future extension. The successful candidate will be offered Grade 5 or Grade 6 on the basis of skill and experience in the role demonstrated by the application and the interview.